Effects of voids on thermal-mechanical reliability of lead-free solder joints

Effects of voids on thermal-mechanical reliability of lead-free solder joints

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Reliability of electronic packages has become a major issue, particularly in systems used in electrical or hybrid cars where severe operating conditions must be met.Many studies have shown that dragon ball lg disney solder interconnects are critical elements since many failure mechanisms originate from their typical response under thermal cycles.In this study, effects of voids in solder interconnects on the electronic assembly lifetime here are estimated based on finite element simulations.